Professor Shiyan Hu received his Ph.D. in Computer Engineering from Texas A&M University in 2008. He is currently a Visiting Associate Professor at Stanford University, and an Associate Professor in Department of Electrical and Computer Engineering at Michigan Tech, where he is Director of the Michigan Tech Cyber-Physical System Research Group and Associate Director of Michigan Tech Institute of Computing and Cybersystems. He was a Visiting Professor at IBM Research (Austin)
Prof. Hu’s research interests include Cyber-Physical Systems, Cybersecurity, Computer-Aided Design of VLSI Circuits, and Embedded Systems, where he has published about 100 refereed papers, including 20+ in IEEE Transactions. His research was featured in the Front Cover of IEEE Transactions on Nanobioscience in March 2014, and his papers have been nominated for IEEE/ACM ICCAD William J. McCalla Best Paper Award in 2009 and IBM Pat Goldberg Best Paper Award in 2008 and 2010. His ultra fast slew buffering technique has been widely deployed in industry, including designing over 50 microprocessor and ASIC chips such as IBM flagship chips POWER 7 and 8. His research has been highlighted in various public media such as IEEE Spectrum, Communications of ACM, Science Daily, CBS and PC World.
Prof. Hu is the Founding Chair for IEEE Technical Committee on Cybernetics for Cyber-Physical Systems. He is an ACM Distinguished Speaker, an IEEE Computer Society Distinguished Visitor, an invited participant for U.S. National Academy of Engineering Frontiers of Engineering Symposium, a recipient of National Science Foundation (NSF) CAREER Award, ACM SIGDA Richard Newton DAC Scholarship (as the faculty advisor), and JSPS Faculty Invitation Fellowship. He is an Associate Editor/Guest Editor for 7 IEEE/ACM Transactions such as IEEE Transactions on Computers and IEEE Transactions on CAD. He has served as General Chair, Technical Program Committee (TPC) Chair, TPC Subcommittee Chair, Session Chair, and TPC Member for various conferences for more than 70 times, which include the TPC Subcommittee Chair for DAC and ICCAD. He is a Senior Member of IEEE.